Future smartphones and liquid cooling

To extend the life of any of our devices, good ventilation is necessary. In this sense, PCs take the lead thanks to the liquid refrigeration, but taking into account how quickly new techniques and technologies advance, what is clear is that future Smartphone and liquid cooling will come together to offer us much more effective performance.

The dangers of overheating

There are many reasons why it is important to avoid overheating in our devices. One of them and that we tend to notice more is the fact that, in the event that any equipment heats up more than necessary, its performance decreases considerably.

But this is not the only reason why we should refrigerate from computers a smart phones and any other device, and the fact is that excessive heat damages the components to the point that we can run out of our device not due to overheating.

Many of you have realized that when you use your Smartphone or Tablet for too long in a row, after a while you begin to notice that it gets hotter than necessary. In these cases, the interesting thing is to let it rest for a while to cool down, which generally only takes a few minutes.

However, if you are playing or working with your device and you cannot afford this waiting time, what is clear is that your devices are receiving an overload that will shorten your life.

Liquid cooling and the Smartphones of the future

Since liquid cooling is one of the best systems to maintain the temperature from our devices, it is clear that this is an essential step for the Smartphones of the future, and more and more, some users perform overclocking with the aim of increasing the performance of your device, which also generates greater heat.

A group of engineers working on the Fujitsu laboratories They have created a system through which a small copper tube is implanted through which water passes, evaporating at one end and condensing at the other with the aim of completing the entire circuit again.

In essence we are talking about a tiny liquid cooling system since it barely has a thickness of 0,6 mm, thus adapting to this type of portable devices without having to increase their size and of course the weight.

It is clear that liquid cooling is going to be the future when it comes to cooling even portable devices, and this Fujitsu experiment It adapts perfectly to the new terminals, plus of course it will help us achieve better performance while extending the useful life of our smartphones.

However, it seems we are going to have to wait until 2017, the date on which it is estimated that the first devices will mount this system.

Meanwhile, work continues with the aim of creating other similar systems for various devices such as medical equipment and other small devices.